MICROELECTRONICS

MICROELECTRONICS

Built To Perform Not Just To Print

In microelectronics assembly, there’s no room for error. That’s why we built our global microelectronics capabilities around cutting-edge production tools and highly experienced teams—allowing us to provide reliable, high-tech manufacturing and engineering solutions for the most highly regulated markets.

Built To Perform Not Just To Print

In microelectronics assembly, there’s no room for error. That’s why we built our global microelectronics capabilities around cutting-edge production tools and highly experienced teams—allowing us to provide reliable, high-tech manufacturing and engineering solutions for the most highly regulated markets.

Mixed And Hybrid Technology Modules And Assemblies

Benchmark Phoenix site co-locates precision microelectronic assembly capabilities with design engineering and Surface Mount Technology (SMT) capabilities, overcoming your size, weight, and power (SWaP) challenges. We excel at developing microelectronics processes for RF systems, particularly at challenging millimeter-wave (mmWave) frequencies. On-site photonics expertise supports the development of photonics test, assembly, and packaging solutions. This combination makes Benchmark the partner of choice for mixed-technology applications in defense, next-gen communications, and advanced computing.

Sites are optimized for low-volume/high mix to medium-volume production. All sites offer numerous certifications and registrations.

Mixed And Hybrid Technology Modules And Assemblies

Benchmark Phoenix site co-locates precision microelectronic assembly capabilities with design engineering and Surface Mount Technology (SMT) capabilities, overcoming your size, weight, and power (SWaP) challenges. We excel at developing microelectronics processes for RF systems, particularly at challenging millimeter-wave (mmWave) frequencies. On-site photonics expertise supports the development of photonics test, assembly, and packaging solutions. This combination makes Benchmark the partner of choice for mixed-technology applications in defense, next-gen communications, and advanced computing.

Sites are optimized for low-volume/high mix to medium-volume production. All sites offer numerous certifications and registrations.

Advanced Capabilities

  • Microelectronics assembly, automation, and test engineering services from one provider
  • Microelectronic packaging capabilities for a wide range of ceramic and open-cavity plastic packages, including System-in-Package (SiP) applications
  • Broad microelectronics bonding and attachment capabilities
  • Customized automated processing for high production volumes
  • Advanced testing and failure analysis capabilities using 2D and 3D x-ray inspection and scanning electron microscopy
  • Precision optical alignment

Advanced Capabilities

  • Microelectronics assembly, automation, and test engineering services from one provider
  • Microelectronic packaging capabilities for a wide range of ceramic and open-cavity plastic packages, including System-in-Package (SiP) applications
  • Broad microelectronics bonding and attachment capabilities
  • Customized automated processing for high production volumes
  • Advanced testing and failure analysis capabilities using 2D and 3D x-ray inspection and scanning electron microscopy
  • Precision optical alignment