LIQUID-COOLED HIGH PERFORMANCE COMPUTING

MECHATRONICS AND ROBOTICS

Ready-to-Use Capabilities and Expertise

Liquid cooling is rapidly becoming the preferred means of thermal management for critical, High Performance Computers (HPCs) such as AI clusters, supercomputers, and government research systems. Liquid cooling increases an HPC’s upper limit of performance, provides improved thermal efficiency, and offers better options for sustainability. However, testing, manufacturing, and scaling are challenging. With proven experience in liquid cooling and fully operational liquid cooling test and manufacturing infrastructure in the U.S., Benchmark can help you accelerate your time-to-deployment.

Delivering Advanced Solutions

Changing a minute detail in one part of a design can significantly impact the overall system in advanced mechatronics and robotics. You need a partner who understands how everything is interconnected. With robust reference designs, advanced manufacturing, and industry-leading engineering capabilities all available in-house, Benchmark is uniquely positioned to deliver high-performance mechatronic devices, modules, and systems, while reducing your costs and shortening your time to market.

Highly Scalable Testing and Manufacturing

Our U.S.-based test and manufacturing grew from decades of building HPCs to fill U.S. government contracts. This heritage provided substantial expertise in multiple forms of HPC, including supercomputing. Our manufacturing record includes several of the current fastest supercomputers and multiple HPC systems on the Top500 supercomputer list. This experience positions us for an expanding range of projects deemed critical.

The high visibility of supercomputer deployments drives demanding deadlines, providing us with the opportunity to develop highly scalable testing and manufacturing methods. Testing, manufacturing, and production ramping of liquid-cooled computing assemblies is complex and typically requires implementing custom mechanical hardware, electronics, software, and security protocols. Benchmark has experience in each of these and can bring any or all of them to bear for your needs.

Leading Capabilities

  • Sensors and optoelectronics
  • Integrated housing
  • Advanced User Interface (UI) systems
  • Autonomy development
  • Full-system integration
  • Software, firmware, and hardware prototyping

Demonstrated Capabilities

Printed circuit board assembly (PCBA) places all components on large-format circuit boards

Full blade assembly places all circuit boards, cold plates, thermal interface material, wiring harnesses, and plumbing into the HPC blade

Functional-circuit testing (FCT) tests assembled blades under actual liquid-cooled conditions, allowing for maximum, high-performance system testing

Fluid purge testing checks the integrity of each blade’s cooling channels and clears fluid from the channels before shipping

Test procedure development and design for test (DFT) both optimize test flows to dramatically cut test time without sacrificing the quality of test

Co-location of test development and manufacturing in the United States allows for end-market proximity and efficient engineering

Information security practices ensure the security and integrity of customer software, designs, firmware, and Benchmark’s information systems

Facilities qualified with relevant certifications ensure all results meet applicable standards

Industry 4.0 Solutions

Our team of experienced designers and software engineers brings Industry 4.0 robotics and automation solutions to the market. We help customers like you achieve market differentiation in this increasing shift towards autonomous and collaborative devices and machines. From motion control to navigation, connectivity, and visual recognition, including Lidar systems, Benchmark can combine the right technologies to create robust, reliable robotic systems.

Seamless Integration and Flexibility

Benchmark’s flexibility allows you to employ our capabilities for any part of your product lifecycle, and we work with your teams to ensure we integrate seamlessly into your existing processes. We also offer many specialized engineering capabilities that can enhance your product design with the convenience of a single product realization partner:

  • Advanced thermal management modeling and solution development ensures efficient heat transfer throughout the entire thermal chain
  • Advanced fluidics design and analysis ensures efficient liquid flow and minimizes cooling system power consumption
  • Precision machining and metal joining create sturdy blade casing, smooth, leak-free fluid channels, and test rigging that meets stringent board stiffness requirements
  • High-speed circuit design and advanced microelectronic manufacturing allow us to design and manufacture cutting-edge printed circuit board assemblies (PCBAs)
  • Electronics miniaturization and circuit densification help fit more compute power into HPC blades
  • Product sustainability services helps reduce carbon footprint, increase recyclability, or meet other sustainability goals